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Contact Layer Bonding Strength and Thermal Cycle Stability

Author(s)
Yeong-Shyung Chou
Keywords
Solid Oxide Cell
Thermal Cycling
Bonding Strength
Abstract

The purpose of this procedure to perform mechanical property test for contact bonding strength and thermal cycle stability.

AWST Technology
High Temperature Electrolysis (HTE)
Protocol #
HTE-P-14
File Upload
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